Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications: 2 (Electronic Packaging and Interconnects, 2)

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Pages: 248, Edition: Softcover reprint of the original 1st ed. 1999, Paperback, Springer

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications: 2 (Electronic Packaging and Interconnects, 2)

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