High Temperature Resistant Silicone Pad for CPU Reballing Withstands up to 200°C heat exposure while maintaining structural integrity, ensuring alignment for mobile chip repairs across multiple smartphone brands. Engineered with a grooves to securely hold CPU chips during soldering operations, this silicone pad enhances accuracy in rework and reduces alignment errors for consistent repair results. Ideal for professional mobile repair technicians, electronics workshop specialists, and multi brand service centers requiring tools for intensive soldering tasks. Optimized for smartphone motherboard repairs, chip replacement projects, and on site servicing scenarios where component and portability are critical for efficient workflow. Crafted from wear resistant silicone, this meets occupational standards.