Temperature Control: Features 160℃50℃ adjustable heating with constant temperature technology to safely soften black glues on CPUs, hard drives, and IC chips without damaging components, improving repair success rates Fast Heating & Efficient glues Removal: Equipped with a high power heating module for warming up, significantly reducing waiting time and speeding up chip glues removal for enhanced repair efficiency Multi Scenario Compatibility: Specifically designed for phone and computer repairs, effectively remove glues from CPUs, baseband chips, and more, making it an essential tool for repair engineers Anti Static & Safe Operations: Built in anti static protections prevents electrostatic damage to sensitive electronics, ideal for repairing phone motherboards and laptop chips Compact & Portable: Designed with an 18×21mm work area and compact body, easily fitting on any desktop without occupying much space, perfect for personals or professional repair shops, Manufacturer: Kaeltsyn