The area of stencil matches the area of BGA chip, which can reduce the waste of solder balls. However, please consider purchasing the stencil for chips with uneven solder ball alignment or different distances. Can be directly heated , the steel mesh is not easy to be deformed by heat. 16 pieces per set. Basically cover the current common BGA chips. Made of stainless steel plate. Good thickness of steel mesh. Universal Direct Heat BGA Stencil for Notebook, for Desktop, for , Northcom and Communication Motherboards and other Graphics Cards and Other Types of BGA Chips., Weight: 0.11353806493 Pounds, Manufacturer: tiyao
The area of stencil matches the area of BGA chip, which can reduce the waste of solder balls. However, please consider purchasing the stencil for chips with uneven solder ball alignment or different distances. Can be directly heated , the steel mesh is not easy to be deformed by heat. 16 pieces per set. Basically cover the current common BGA chips. Made of stainless steel plate. Good thickness of steel mesh. Universal Direct Heat BGA Stencil for Notebook, for Desktop, for , Northcom and Communication Motherboards and other Graphics Cards and Other Types of BGA Chips., Weight: 0.11353806493 Pounds, Manufacturer: tiyao
Price now:
£8.46 | Amazon | Shop |