Ultra-thin patching experience with immediate use after tear open protection. Suitable for various sizes and shapes of solder joints on mobile phones. Enhanced fixed pins for seamless repair of mobile phone pads. Replaces traditional flying wires to achieve the original solder pad effect. Ideal for repairing dropped solder pads on mobile phone motherboards, mid-layer CPUs, WiFi hard drives, and more, ensuring stability against drops, shaking, or squeezing., Weight: 0.0440924524 pounds, Manufacturer: Ehwisbe