2. Larger Cooling , Full Device Cooling: Mobile phone cooling plate heat sink precisely fits CPU heat source, covering most of the CPU area. L-shaped cooling targets the heat source directly, ensuring a even during long gaming sessions. 3. Magnetic and Clip-On Modes: Easily switch between magnetic attachment and clip-on modes. Smartphone cooler cooling pad includes a clip for phones without magnetic capability, ensuring versatile use. 4. Three Adjustable Levels, Real-Time Temperature Display: Three different temperature settings with easy one-button adjustment. Semiconductor phone cooling plate is equipped with a digital display module for real-time temperature monitoring. Three-color gaming lights enhance the gaming atmosphere. 1. Advanced Cooling Technology, Protects Device: Built-in intelligent temperature control chip maintains low phone temperature. Phone cooling pad heatsink uses TEC semiconductor cooling chip for efficient cooling without compromising on quality. 5. and Unobtrusive, Only 89g: Compact design of mobile phone semiconductor cooler does not obstruct gameplay. and portable, ensuring comfort during extended gaming sessions. Includes a 1/4-inch screw port for easy installation on live streaming stands, providing smooth, low-temperature streaming., Manufacturer: Akfldms