1. Breakthrough refrigeration technology, TEC temperature control chip, every part is , providing an upgrading experience beyond ordinary radiators 2. Semiconductor superconducting refrigeration plate, refrigeration speed is 6 times faster, and TEC refrigeration area is expanded by 3 times Close fit, increased cooling speed, seamless fit to the phone, high thermal conductivity cooling for even heat dissipation 4. Silent noise reduction design, the sound is too small to be heard, decibels less than equal 25dB 3. Powerful turbo fan, silent cooling, 9-blade large angled fan blades for cooling 5. Compatible with 99% of mobile phones on the market, regardless of model.