Large infrared soldering area. Effective soldering area: 370×450mm; significantly expands equipment applicability for cost-effective investment. Multiple soldering cycles available. Eight preset soldering cycle parameters enable fully automated completion of the entire soldering process from preheating and soaking to reflow and cooling. Comprehensively optimised heating and thermal equilibrium design. Utilises up to 800W energy-efficient infrared heating coupled with an air circulation system to achieve solder reflow. Ergonomic design for convenient and practical operation. Combining precision craftsmanship with a lightweight structure and compact footprint, the T962A+ can be easily positioned on a workbench, facilitating transport and storage. Comprehensive functionality: The T962A+ can solder most small components on bump-type or double-sided PCBs, such as CHIP, SOP, PLCC, QFP, and BGA. It serves as an ideal solution for both single-item rework and on-demand small-batch production., Manufacturer: WAFOHSR